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  gsf32-16x16/90 32 mbyte simm flash memory module tentative data 80 pins jedec 21-c package fast access time: 90ns 5v 10% single power supply operation byte programming time: 10 m s typical erase time C sector: 1.0 sec typical C bulk: 32 sec typical program/erase controller (p/e.c.) C program byte-by-byte C data polling and toggle protocol for p/e.c. status memory erase in sectors C 32 sectors of 64k bytes each C sector protection C multisector erase erase suspend and resume modes 100,000 program/erase cycles per sector depopulated versions available: 16 mbyte => gsf16-8x16/90 8 mbyte => gsf8-4x16/90 a0-a20 address inputs dq0-dq31 data input / outputs ce0-ce3 chip enable oe output enable we0-we3 w rite enable pd1-pd4 presence & module type detect pd5-pd7 module speed detect vcc-vss power supply - ground table 1. signal n ames 29 october 1997 1/4 this is preliminary information on a new product now in development or un dergoing evaluation. details are subject to change without notice. description the gsf32-16x16/90 is a 32 mbyte simm memory module built around 16 x 29f016 flash memory chips (please see relevant data sheet for all de- tailed informations about the chip performances). the devices are mounted on a jedec 21-c stand- ardized simm printed circuit. organisation figure 1 shows the block diagram. the flash module is organized as 16 x 2m x 8 bits with address lines a0-a20 and data inputs/outputs dq0 to 7, dq8 to 15, dq16 to 23 and dq24 to 31. memory control is provided by 4 chip enable (ce0,
1,2,3) inputs used to address the 4 memory banks and by 4 write enable inputs used to select through the four dq0-7, dq8-15, dq16-23, dq24-31 groups. an output enable input is used to read the stored data. erase and program functions are performed through the internal program/erase controller (p/e.c.). configuration & speed pins pd1-pd4 pins are used by the simm module to inform the motherboard about its relevant configu- ration while pd5 to pd7 are used to inform about the speed of the chips u sed. as the module allocates 32mbyte memory, using 90 ns chips, configuration is the following: pd1 : vss pd2 : vss pd3 : vss pd4 : vss pd5 : vss pd6 : vss pd7 : vss other c onfigurations the 32 mbyte module can be also depopulated in order to achieve 16 m and 8 mbyte configurations. part numbers are as follows: 16mbyte : gsf16-8x16/70 8 mbyte : gsf8-4x16/90 depopulation consists in removing banks 3 and 4 to achieve the 16 m and also bank 2 to achieve the 8 mbyte configuration. configuration pins pd1 to pd4 becomes as foll ows: 16 mbyte: pd1 : open pd2 : vss pd3 : vss pd4 : vss 8 mbyte: pd1 : vss pd2 : open pd3 : vss pd4 : vss oe addr dq0-7 ce we oe addr ce we oe addr ce we oe addr dq0-7 dq0-7 dq0-7 ce we oe addr dq0-7 ce we oe addr ce we oe addr ce we oe addr dq0-7 dq0-7 dq0-7 ce we oe addr dq0-7 ce we oe addr ce we oe addr ce we oe addr dq0-7 dq0-7 dq0-7 ce we oe addr dq0-7 ce we oe addr ce we oe addr ce we oe addr dq0-7 dq0-7 dq0-7 ce we we3 we2 we1 we0 oe a0 - a20 dq0 - dq7 dq8 - dq15 dq16 - dq23 dq24 - dq31 ce0 ce1 ce2 ce3 bank 1 bank 2 bank 3 bank 4 fig. 1. block diagram 2/4 gsf32-16x16/90
pin name pin name pin name pin name 1 vss 21 ce3 41 a11 61 dq9 2 vcc 22 ce2 42 a10 62 dq8 3 pin 71 23 ce1 43 a9 63 dq7 4 oe 24 ce0 44 a8 64 dq6 5 we0 25 vss 45 a7 65 dq5 6 we1 26 dq29 46 a6 66 dq4 7 nc 27 dq30 47 a5 67 dq3 8 dq16 28 dq31 48 a4 68 dq2 9 dq17 29 we2 49 a3 69 dq1 10 dq18 30 nc 50 a2 70 dq0 11 dq19 31 nc 51 a1 71 pin 3 12 dq20 32 a20 52 a0 72 vcc 13 dq21 33 a19 53 we3 73 pd1 14 dq22 34 a18 54 vss 74 pd2 15 dq23 35 a17 55 dq15 75 pd3 16 dq24 36 a16 56 dq14 76 pd4 17 dq25 37 a15 57 dq13 77 pd5 18 dq26 38 a14 58 dq12 78 pd6 19 dq27 39 a13 59 dq11 79 pd7 20 dq28 40 a12 60 dq10 80 vss table 1. pin con figuration 118 10.16 6.35 2.0 111.35 3.175 1404180 31 3.90 3.175 1.27 components area 2.54 0.25 3.18 r 1.6 1.27 figure 2. mechanical dimensions 3/4 gsf32-16x16/90
information furnished is believed to be accurate and reliab le. however, s gs-thomson micr oelectronics assumes no res ponsibility for the consequences of use of such information nor for any infringement of pa tents or other rights of third parties which may result from its u se. no license is granted by implication or otherwise under any patent or patent rights of sgs-thomson mi croelectron ics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and repla ces all information previously supplied. sgs-thomson microelectronics products are not authorized for use as cr itical components in life support devi ces or systems without express written approval of s gs-thomson microelectronics. ? 1997 sgs-thomson microelectronics - all rights reserved sgs-thomson microelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - morocco - the neth erlands - singapore - spain - sweden - switzerland - taiwan - thai land - united king dom - u.s.a. 4/4 gsf32-16x16/90


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